An integrated circuit die includes a stack of a substrate and multiple layers extending in parallel to the substrate. A number of integrated electronic components is formed in the stack, and connected to form an electronic circuit. The electronic circuit comprises a first electric contact, a second electric contact, and a coupling which couples the electric strips electrically to each other. The coupling includes a circuit via which extends through at least two of the layers. The die further includes an integrated current sensor having a coil arrangement for sensing a current flowing through a part of the electronic circuit. The coil arrangement is magnetically coupled to the circuit via over at least a part of a length of the circuit via to sensing a magnetic flux through the circuit via. A measurement unit can measure a parameter of the coil arrangement representative of a current flowing through the circuit via.