Invention Grant
- Patent Title: Spring assembly and damper device including spring assembly
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Application No.: US15435587Application Date: 2017-02-17
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Publication No.: US10041561B2Publication Date: 2018-08-07
- Inventor: Takeshi Senoue , Masahiro Nakatani
- Applicant: EXEDY Corporation
- Applicant Address: JP Neyagawa-shi, Osaka
- Assignee: EXEDY CORPORATION
- Current Assignee: EXEDY CORPORATION
- Current Assignee Address: JP Neyagawa-shi, Osaka
- Agency: United IP Counselors, LLC
- Priority: JP2016-055312 20160318
- Main IPC: F16F1/04
- IPC: F16F1/04 ; F16F15/123 ; F16F1/02 ; F16D3/12 ; F16D13/64 ; F16D13/68
Abstract:
A spring assembly includes a first coil spring and a second coil spring. The second coil spring includes a first winding portion and a second winding portion. The first winding portion includes a plurality of windings from a first winding to at least a second winding. The second winding portion is a portion except for the first winding portion. An outer diameter of each of the plurality of windings of the first winding portion is smaller than an outer diameter of each of at least one winding of the second winding portion. Each of the plurality of windings of the first winding portion includes the substantially same outer diameter.
Public/Granted literature
- US20170268590A1 SPRING ASSEMBLY AND DAMPER DEVICE INCLUDING SPRING ASSEMBLY Public/Granted day:2017-09-21
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