- Patent Title: High-purity yttrium, process of producing high-purity yttrium, high-purity yttrium sputtering target, metal gate film deposited with high-purity yttrium sputtering target, and semiconductor element and device equipped with the metal gate film
-
Application No.: US14130523Application Date: 2011-09-15
-
Publication No.: US10041155B2Publication Date: 2018-08-07
- Inventor: Masahiro Takahata
- Applicant: Masahiro Takahata
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Howson & Howson LLP
- Priority: JP2011-150067 20110706
- International Application: PCT/JP2011/071131 WO 20110915
- International Announcement: WO2013/005349 WO 20130110
- Main IPC: C22C28/00
- IPC: C22C28/00 ; C22B59/00 ; C25C3/34 ; C23C14/34

Abstract:
Provided are high-purity yttrium and a high-purity yttrium sputtering target each having a purity, excluding rare earth elements and gas components, of 5 N or more and containing 1 wt ppm or less of each of Al, Fe, and Cu; a method of producing high-purity yttrium by molten salt electrolysis of a raw material being a crude yttrium oxide having a purity, excluding gas components, of 4N or less at a bath temperature of 500° C. to 800° C. to obtain yttrium crystals, desalting treatment, water washing, and drying of the yttrium crystals, and then electron beam melting for removing volatile materials to achieve a purity, excluding rare earth elements and gas components, of 5N or more; and a technology capable of efficiently and stably providing high-purity yttrium, a sputtering target composed of the high-purity yttrium, and a metal-gate thin film mainly composed of the high-purity yttrium.
Public/Granted literature
Information query