Invention Grant
- Patent Title: Pb-free copper alloy sliding material
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Application No.: US13555639Application Date: 2012-07-23
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Publication No.: US10041148B2Publication Date: 2018-08-07
- Inventor: Hiromi Yokota , Daisuke Yoshitome
- Applicant: Hiromi Yokota , Daisuke Yoshitome
- Applicant Address: JP Toyota-shi
- Assignee: TAIHO KOGYO CO., LTD.
- Current Assignee: TAIHO KOGYO CO., LTD.
- Current Assignee Address: JP Toyota-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-213986 20060805; JP2006-219709 20060811
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C22C32/00 ; C22C9/02

Abstract:
When a Cu—Sn—Bi had—particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
Public/Granted literature
- US20120294750A1 PB-FREE COPPER ALLOY SLIDING MATERIAL Public/Granted day:2012-11-22
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