- Patent Title: Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer
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Application No.: US14814939Application Date: 2015-07-31
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Publication No.: US10040981B2Publication Date: 2018-08-07
- Inventor: Luca Marchese , Fabio Ticozzelli , Ruediger Butterbach , Judith Siepenkothen , Juergen Foell , Fabio Spada
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Priority: EP13154231 20130206
- Main IPC: C09J153/00
- IPC: C09J153/00 ; C08L53/00 ; C08K5/00 ; C08K3/00 ; C09J177/06 ; C08L23/00 ; C08L77/00 ; C08K3/01

Abstract:
The invention discloses a hot melt composition comprising a block copolymer consisting of at least two blocks as reaction product of a polyamide having a molecular weight of 5000 g/mol to 100000 g/mol and a modified olefin copolymer having a molecular weight of 3000 to 100000 g/mol and containing covalently bound organic acid anhydride groups to the polymer chain, wherein the polyamide has an amine number from 0.2 to 10 and the olefin copolymer has an acid number from 1 to 100.
Public/Granted literature
- US20150337186A1 HOT MELT ADHESIVE CONTAINING A POLYAMIDE/ POLYOLEFIN HYBRID POLYMER Public/Granted day:2015-11-26
Information query
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