Invention Grant
- Patent Title: Surface-structured processing element for ultrasonic processing
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Application No.: US15503659Application Date: 2015-10-14
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Publication No.: US10040243B2Publication Date: 2018-08-07
- Inventor: Ulrich Vogler
- Applicant: Herrmann Ultraschalltechnik GmbH & Co. KG
- Applicant Address: DE Karlsbad
- Assignee: HERRMANN ULTRASCHALLTECHNIK GMBH & CO. KG
- Current Assignee: HERRMANN ULTRASCHALLTECHNIK GMBH & CO. KG
- Current Assignee Address: DE Karlsbad
- Agency: Paul & Paul
- Priority: DE102014115538 20141024
- International Application: PCT/EP2015/073824 WO 20151014
- International Announcement: WO2016/062596 WO 20160428
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B29C65/08 ; B06B3/00 ; B23K20/10 ; B29C65/00

Abstract:
The present invention concerns a processing element for processing a material, like for example a sonotrode or an anvil, comprising a carrier surface which is substantially in the form of a cylinder or in the form of a segment of a cylinder and which is intended to come into contact with the material during processing, wherein the processing element is intended to be rotated about its longitudinal axis during processing so that the carrier surface rolls on the material to be processed, wherein arranged on the carrier surface is at least one structure element which projects beyond the carrier surface in the radial direction, wherein the structure element has a top side which is provided to come into contact with the material to be processed. To provide a processing element which reduces the abrupt deflection of the sonotrode when the material comes into engagement with and/or comes out of engagement with the carrier surface it is proposed according to the invention that the top side is at least portion-wise convexly curved in the peripheral direction with a radius of curvature which is less than the greatest spacing of the top side from the cylinder axis or comprises at least two surface portions which include an angle
Public/Granted literature
- US20170266872A1 SURFACE-STRUCTURED PROCESSING ELEMENT FOR ULTRASONIC PROCESSING Public/Granted day:2017-09-21
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