Invention Grant
- Patent Title: Multi-manifold extrusion die with deckle system and method of using same
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Application No.: US14288062Application Date: 2014-05-27
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Publication No.: US10040234B2Publication Date: 2018-08-07
- Inventor: Jordan L. Sedivy
- Applicant: Nordson Extrusion Dies Industries, LLC
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: Baker & Hostetler LLP
- Main IPC: B29C47/06
- IPC: B29C47/06 ; B29C47/16 ; B29C47/08 ; B29C47/14 ; B29C47/00
Abstract:
A multi-manifold extrusion die having a fully independent internal deckle system. The die can selectively produce a composite extrudate having a full-width arrangement, an encapsulation arrangement, or a naked-edge arrangement. Methods are also provided for producing a composite extrudate having a full-width arrangement, an encapsulation arrangement, or a naked-edge arrangement.
Public/Granted literature
- US20150343690A1 Multi-Manifold Extrusion Die with Deckle System and Method of Using Same Public/Granted day:2015-12-03
Information query
