Invention Grant
- Patent Title: Shield film, shielded printed wiring board, and method for manufacturing shield film
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Application No.: US14360609Application Date: 2012-10-12
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Publication No.: US10015915B2Publication Date: 2018-07-03
- Inventor: Hiroshi Tajima , Sirou Yamauchi , Kenji Kamino , Masahiro Watanabe
- Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Applicant Address: JP Osaka
- Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Current Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Potomac Law Group, PLLC
- Agent Kenneth Fagin
- Priority: JP2011-256816 20111124
- International Application: PCT/JP2012/076473 WO 20121012
- International Announcement: WO2013/077108 WO 20130530
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K3/28

Abstract:
To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 μm to 12 μm thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
Public/Granted literature
- US20140326484A1 Shield Film, Shielded Printed Wiring Board, And Method for Manufacturing Shield Film Public/Granted day:2014-11-06
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