Disclosed is a light emitting diode (LED) package for a lamp of a vehicle. The LED package includes a printed circuit board (PCB) which includes a metal layer, an insulating layer formed on the metal layer, and an electric wiring layer formed on the insulating layer; an LED circuit unit which includes an LED chip mounted on the electric wiring layer; and a connector which is mounted on the electric wiring layer to be connected with the LED chip. Area and thickness of the printed circuit board and position of the LED chip on the printed circuit board can be determined based on thermal resistance of the LED chip and thermal resistance of the PCB.