Invention Grant
- Patent Title: High electron mobility transistor (HEMT) device structure
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Application No.: US15434325Application Date: 2017-02-16
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Publication No.: US10014402B1Publication Date: 2018-07-03
- Inventor: Kuei-Ming Chen , Chi-Ming Chen , Chung-Yi Yu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L29/20 ; H01L29/205 ; H01L29/10 ; H01L29/207 ; H01L29/417 ; H01L23/31 ; H01L21/02

Abstract:
A high electron mobility transistor (HEMT) device structure is provided. The HEMT device structure includes a channel layer formed over a substrate and an active layer formed over the channel layer. The HEMT device structure also includes a gate structure formed over the active layer, and the gate structure includes: a p-doped gallium nitride (p-GaN) layer or a p-doped aluminum gallium nitride (p-GaN) layer formed over the active layer, and a portion of the p-GaN layer or p-AlGaN layer has a stepwise or gradient doping concentration. The HEMT device structure also includes a gate electrode over the p-GaN layer or p-AlGaN layer.
Public/Granted literature
- US20180166565A1 HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) DEVICE STRUCTURE Public/Granted day:2018-06-14
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