Invention Grant
- Patent Title: Manufacturing method of semiconductor device and semiconductor device
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Application No.: US15717397Application Date: 2017-09-27
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Publication No.: US10014385B2Publication Date: 2018-07-03
- Inventor: Hideki Makiyama
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2016-017816 20160202
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L21/66 ; H01L23/522 ; H01L27/12 ; H01L21/02 ; H01L21/768 ; H01L29/66 ; H01L21/265 ; H01L21/311 ; H01L21/84

Abstract:
The thickness of an insulating film, which will serve as an offset spacer film and is formed in an offset monitor region, is managed as the thickness of an offset spacer film formed over the side wall surface of a gate electrode of an SOTB transistor STR, etc. When the measured thickness is within the tolerance of a standard thickness, standard implantation energy and a standard dose amount are set. When the measured thickness is smaller than the standard thickness, implantation energy and a dose amount, which are respectively lower than the standard values thereof, are set. When the measured thickness is larger than the standard thickness, implantation energy and a dose amount, which are respectively higher than the standard values thereof, are set.
Public/Granted literature
- US20180019315A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE Public/Granted day:2018-01-18
Information query
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