Invention Grant
- Patent Title: Memory first process flow and device
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Application No.: US15281010Application Date: 2016-09-29
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Publication No.: US10014380B2Publication Date: 2018-07-03
- Inventor: Shenqing Fang , Chun Chen , Unsoon Kim , Mark Ramsbey , Kuo Tung Chang , Sameer Haddad , James Pak
- Applicant: Cypress Semiconductor Corporation
- Applicant Address: US CA San Jose
- Assignee: Cypress Semiconductor Corporation
- Current Assignee: Cypress Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L29/423 ; H01L29/51 ; H01L29/792 ; H01L29/49 ; H01L29/788 ; H01L29/66 ; H01L21/28 ; H01L21/02

Abstract:
A semiconductor device and method of making the same are disclosed. The semiconductor device includes a memory gate on a charge storage structure formed on a substrate, a select gate on a gate dielectric on the substrate proximal to the memory gate, and a dielectric structure between the memory gate and the select gate, and adjacent to sidewalls of the memory gate and the select gate, wherein the memory gate and the select gate are separated by a thickness of the dielectric structure. Generally, the dielectric structure comprises multiple dielectric layers including a first dielectric layer adjacent the sidewall of the memory gate, and a nitride dielectric layer adjacent to the first dielectric layer and between the memory gate and the select gate. Other embodiments are also disclosed.
Public/Granted literature
- US20170141201A1 Memory First Process Flow and Device Public/Granted day:2017-05-18
Information query
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