Invention Grant
- Patent Title: Silicon carbide semiconductor device having a trench with side walls and method for manufacturing same
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Application No.: US14912433Application Date: 2014-07-16
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Publication No.: US10014376B2Publication Date: 2018-07-03
- Inventor: Takeyoshi Masuda , Hideto Tamaso
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Kerri M. Patterson
- Priority: JP2013-184813 20130906
- International Application: PCT/JP2014/068881 WO 20140716
- International Announcement: WO2015/033674 WO 20150312
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/16 ; H01L21/04 ; H01L29/423 ; H01L29/66 ; H01L29/04 ; H01L29/06

Abstract:
A silicon carbide semiconductor device includes: a silicon carbide off substrate including a main surface having an off angle relative to a basal plane, the main surface being provided with a trench, the trench having a plurality of side walls and a bottom portion; a gate insulating film covering the side walls and the bottom portion; and a gate electrode provided on the gate insulating film, each of the side walls having an angle of more than 65° and not more than 80° relative to the basal plane in the trench, opening directions of the plurality of side walls being all at a silicon plane side or a carbon plane side.
Public/Granted literature
- US20160204206A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2016-07-14
Information query
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