Invention Grant
- Patent Title: Back-side illuminated pixels with interconnect layers
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Application No.: US14836599Application Date: 2015-08-26
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Publication No.: US10014333B2Publication Date: 2018-07-03
- Inventor: Sergey Velichko , Christopher Silsby
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Treyz Law Group, P.C.
- Agent Joseph F. Guihan
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/148

Abstract:
An imaging pixel may be provided with an upper substrate layer, a lower substrate layer, a floating diffusion region in the upper substrate layer, and a photodiode in the upper substrate layer that is coupled to the floating diffusion region. The imaging pixel may also include a source follower transistor in the lower substrate layer and an interconnect layer in between the upper substrate layer and the lower substrate layer. The interconnect layer may couple the floating diffusion region directly to the source follower transistor. The imaging pixel may include a reset transistor in the upper substrate layer. The imaging pixel may include a metal layer in the lower substrate layer, a transfer transistor in the upper substrate layer, and an interconnect layer that couples the transfer transistor to the metal layer.
Public/Granted literature
- US20170062501A1 BACK-SIDE ILLUMINATED PIXELS WITH INTERCONNECT LAYERS Public/Granted day:2017-03-02
Information query
IPC分类: