A heating device includes a base body 2 that has a placement surface 2a for placing a wafer W thereon; a heating resistor 4 that is embedded in the base body 2; a cylindrical supporting body 3 that has one end surface 3a that is connected to a back surface 2b of the base body 2 that is on an opposite side of the placement surface 2a, the one end surface 3a having an open end; at least two supporting-body channels 5, 6 that are formed within a peripheral wall of the cylindrical supporting body 3; and a base-body channel 7 that is provided at only a portion of the base body 2 at an immediately overhead region of the cylindrical supporting body 3, and that extends through the base body 2 and connects the at least two supporting-body channels 5, 6 to each other.