Invention Grant
- Patent Title: Adhesive patch
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Application No.: US12548571Application Date: 2009-08-27
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Publication No.: US10010453B2Publication Date: 2018-07-03
- Inventor: Jun Harima , Masakatsu Konno , Ryo Hashino , Akira Numata
- Applicant: Jun Harima , Masakatsu Konno , Ryo Hashino , Akira Numata
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008/219189 20080828
- Main IPC: A61F13/00
- IPC: A61F13/00 ; A61F13/02

Abstract:
An adhesive patch containing an adhesive patch main part containing a support and an adhesive layer laminated on the support, wherein the adhesive patch main part has a peripheral part, a central part, and an intermediate part between the peripheral part and the central part, the intermediate part of the adhesive patch main part has a thickness greater than that of the central part of the adhesive patch main part, and the central part of the adhesive patch main part has a thickness greater than that of the peripheral part of the adhesive patch main part, and a production method thereof.
Public/Granted literature
- US20100056972A1 ADHESIVE PATCH Public/Granted day:2010-03-04
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