A sunlight-similar full-spectrum LED light source package relates to the technical field of LED packaging. The package includes embankment glue, gold wires, fluorescent colloid, LED light-emitting chips, and a substrate; the plurality of LED light-emitting chips are arranged on the substrate, two adjacent LED chips are connected with each other through gold wires, and the LED light-emitting chipson both sides are connected with the substrate through gold wires. The exterior of several LED light-emitting chips is provided with fluorescent colloid, and the periphery of the fluorescent colloid is surrounded by embankment glue. The light beam emitted by the fluorescent powder in the fluorescent colloid after excitation of the LED light-emitting chips constitutes a full spectrum. The package overcomes the drawbacks of the prior art, greatly reduces the harm of blue light, has better continuity of the full-spectrum spectrum, is closer to the sunlight, can be applied to any place needing lighting, and has stronger practicability.