The invention relates to the field of laser machining, in particular to a micromachining method for removing paint layers by lasers. An ultraviolet laser is utilized to remove the paint layers of local areas of varnished wires, and the thicknesses of the paint layers of the varnished wires are from 5 microns to 95 microns. The ultraviolet laser is adopted for micromachining, laser machining parameters are designed, a high-density crossed filling and low-power multi-marking mode is adopted, the ultrathin paint layers with the thicknesses from 5 microns to 95 microns are removed, the power is lower than the damage threshold of copper wires, heat effects are reduced, no damage is caused to the surfaces of the copper wires like traditional paint removal by lasers, high accuracy is realized, the product quality is greatly improved, and the production cost is reduced.