The invention discloses an IC packaging process which comprises S1 of adhering an electrode to a light-transmitting substrate by using glue so as to form an IC package loading plate; S2, carrying outIC packaging on the IC package loading plate to form a packaging body, S3, reducing the viscosity of the glue, so that the light-transmitting substrate is separated from the packaging body; and S4, subjecting the packaging body to surface treatment, electric measurement, segmentation or packaging to complete IC packaging process. The packaging process is optimized. After the product is packaged, the light-transmitting substrate and the packaged integrated circuit are easy to separate, so that the cost is saved, and green production is facilitated.