The invention discloses a chip packaging overflow detection method, and aims to detect the original film overflow degree after packaging in a QFN plastic packaging process; the method comprises the following steps: firstly using an industrial camera to collect a packaged original film grey-scale image on a chip plastic packaging production line, and carrying out enhancement and binary treatment for the grey scale image; carrying out edge detection for the processed image, screening detected edges so as to remove edges with small periphery, and using an annular slide window to detect a chip concentration zone for the screened processed image; finally using a detected chip matrix to search an overflow zone, and calculating the overflow index. After actual field tests, the method can reliably detect the overflow degree of each chip, thus greatly optimizing the overflow degrees in the chip packaging process.