A resin composition is provided. The resin composition comprises: (a) a resin of formula (I) as shown in the description and (b) a solvent, wherein X, Y, R1 to R4, A1, A2, m and n are defined in the specification. The invention also provides a prepreg which is produced by permeating a base material to the above resin composition and drying. The invention provides a laminated plate which comprises a composition layer and a metal layer, wherein the composition layer is provided by the above prepreg. The physico-chemical properties (such as water absorption, flame retardancy, Dk, Df and the like) of laminated plate manufactured by the resin composition can reach a satisfactory degree, and good heat-resisting property (high Tg and good dip soldering resistance) is also comprised, and the application range is wider than before.