An electronic component device 1 includes a first electronic component 10 on which a first electrode pad 14 is disposed, a second electronic component 20 on which a second electrode pad 24 having a first pad portion 24a and a second pad portion 24b is disposed, a first bonding wire W1 having one end connected to the first electrode pad 14 and the other end connected to the first pad portion 24a, and a second bonding wire W2 having one end connected to a connection portion C1 between the first pad portion 24a and the first bonding wire W1 and the other end connected to the second pad portion 24b. The second electrode pad 24 is disposed on the second electronic component 20 so that the first pad portion 24a and the second pad portion 24b are laid along a direction intersecting with an extending direction of the first bonding wire W1. The extending direction of the first bonding wire W1 intersects with an extending direction of the second bonding wire W2.